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NDF04N60Z, NDP04N60Z, NDD04N60Z N-Channel Power MOSFET 1.8 W, 600 Volts
Features
* * * *
Low ON Resistance Low Gate Charge 100% Avalanche Tested These Devices are Pb-Free and are RoHS Compliant
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VDSS 600 V RDS(ON) (TYP) @ 2 A 1.8
Applications
* Adapter (Notebook, Printer, Gaming) * LCD Panel Power * Lighting Ballasts
ABSOLUTE MAXIMUM RATINGS (TC = 25C unless otherwise noted)
Rating Drain-to-Source Voltage Continuous Drain Current Continuous Drain Current TA = 100C Pulsed Drain Current, VGS @ 10V Power Dissipation (Note 1) Gate-to-Source Voltage Single Pulse Avalanche Energy, L = 6.4 mH, ID = 4.0 A ESD (HBM) (JESD 22-114-B) RMS Isolation Voltage (t = 0.3 sec., R.H. 30%, TA = 25C) (Figure 13) Peak Diode Recovery Continuous Source Current (Body Diode) Maximum Temperature for Soldering Leads, 0.063 (1.6 mm) from Case for 10 s Package Body for 10 s Operating Junction and Storage Temperature Range Symbol VDSS ID ID IDM PD VGS EAS Vesd VISO 4500 NDF NDD/NDP Unit V A A A W V mJ V - V NDF04N60ZG or NDP04N60ZG AYWW Gate Source 4 Drain 1 23 Gate Drain Source 1 2 600 (Note 1) 4.0 (Note 2) 2.7 (Note 2) 14 (Note 2) 28 30 51 2500 95 4 4 12 1 1 3 2 2 3 3 3 DPAK TO-220FP TO-220AB IPAK CASE 221D CASE 221A CASE 369D CASE 369AA STYLE 2 STYLE 1 STYLE 5 STYLE 2
MARKING DIAGRAMS
4 Drain YWW 4N 60ZG Drain 2 1 Drain 3 Gate Source A Y WW G = Location Code = Year = Work Week = Pb-Free Package
dv/dt IS TL TPKG
4.5 (Note 3) 4.0 300 260
V/ns A C
TJ, Tstg
-55 to 150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface mounted on FR4 board using 1 sq. pad size, 1 oz cu 2. Limited by maximum junction temperature 3. ISD = 4.0 A, di/dt 100 A/ms, VDD BVDSS, TJ = +150C
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2009
June, 2009 - Rev. 0
1
YWW 4N 60ZG Publication Order Number: NDF04N60Z/D
NDF04N60Z, NDP04N60Z, NDD04N60Z
THERMAL RESISTANCE
Parameter Junction-to-Case (Drain) Junction-to-Ambient Steady State (Note 4) Symbol RqJC RqJA NDF04N60Z 4.4 50 NDD/NDP 1.3 50 Unit C/W
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Drain-to-Source Leakage Current VGS = 0 V, ID = 1 mA Reference to 25C, ID = 1 mA VDS = 600 V, VGS = 0 V VGS = 20 V VGS = 10 V, ID = 2.0 A VDS = VGS, ID = 250 mA VDS = 15 V, ID = 2.0 A 25C 150C IGSS RDS(on) VGS(th) gFS Ciss Coss Crss VDD = 300 V, ID = 4.0 A, VGS = 10 V Qg Qgs Qgd Rg td(on) VDD = 300 V, ID = 4.0 A, VGS = 10 V, RG = 5 tr td(off) tf 3.0 3.3 535 62 14 19 3.9 10 4.7 13 9.0 24 15 W ns nC 1.8 BVDSS DBVDSS/ DTJ IDSS 600 0.6 1 50 10 2.0 4.5 mA W V S pF V V/C mA Test Conditions Symbol Min Typ Max Unit
Gate-to-Source Forward Leakage ON CHARACTERISTICS (Note 5) Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Gate Resistance RESISTIVE SWITCHING CHARACTERISTICS Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
VDS = 25 V, VGS = 0 V, f = 1.0 MHz
SOURCE-DRAIN DIODE CHARACTERISTICS (TC = 25C unless otherwise noted) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge 4. Insertion mounted 5. Pulse Width 380 ms, Duty Cycle 2%. IS = 4.0 A, VGS = 0 V VGS = 0 V, VDD = 30 V IS = 4.0 A, di/dt = 100 A/ms VSD trr Qrr 285 1.3 1.6 V ns mC
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2
NDF04N60Z, NDP04N60Z, NDD04N60Z
TYPICAL CHARACTERISTICS
8 TJ = 25C ID, DRAIN CURRENT (A) 6 8 10 V 7V 6.8 V 6.6 V 4 6.4 V 6.2 V 2 6.0 V 5.8 V 0 5.6 V 0 5 10 15 20 25 VDS, DRAIN-TO-SOURCE VOLTAGE (V) 0 TJ = -55C 3 4 5 6 7 8 VGS, GATE-TO-SOURCE VOLTAGE (V) VDS 30 V ID, DRAIN CURRENT (A) 6
15 V
4 TJ = 150C 2 TJ = 25C
Figure 1. On-Region Characteristics
RDS(on), DRAIN-TO-SOURCE RESISTANCE (W) 3.5 3 2.5 2 1.5 1 ID = 2 A TJ = 25C RDS(on), DRAIN-TO-SOURCE RESISTANCE (W) 3
Figure 2. Transfer Characteristics
TJ = 25C 2.5
2
VGS = 10 V
1.5
5
6
7 VGS (V)
8
9
10
1 0.5
1
1.5
2
2.5
3
3.5
4
ID, DRAIN CURRENT (A)
Figure 3. On-Resistance vs. Gate Voltage
2.6 RDS(on), DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) ID = 2 A VGS = 10 V IDSS, LEAKAGE (nA) 2 1000 10,000
Figure 4. On-Resistance vs. Drain Current and Gate Voltage
VGS = 0 V TJ = 150C
1.4
100 TJ = 100C
0.8
0.2 -50
-25
0
25
50
75
100
125
150
10
0
100
200
300
400
500
600
TJ, JUNCTION TEMPERATURE (C)
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
Figure 5. On-Resistance Variation with Temperature
Figure 6. Drain-to-Source Leakage Current vs. Voltage
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3
NDF04N60Z, NDP04N60Z, NDD04N60Z
TYPICAL CHARACTERISTICS
1200 1000 C, CAPACITANCE (pF) 800 600 400 Coss 200 0 Crss 0 50 100 150 Ciss VGS = 0 V TJ = 25C 20 400
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
VGS, GATE-TO-SOURCE VOLTAGE (V)
15 VDS
QT
300
10 Qgs 5 TJ = 25C ID = 4 A 0 5 10 15 Qgd VGS
200
100
200
0
0 20
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
Qg, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
1000 VDD = 300 V ID = 4 A VGS = 10 V t, TIME (ns) 100
Figure 8. Gate-to-Source and Drain-to-Source Voltage vs. Total Charge
td(off) IS, SOURCE CURRENT (A) tr tf td(on) 4 VGS = 0 V TJ = 25C 3
2
10
1
1
1
10 RG, GATE RESISTANCE (W)
100
0 0.4
0.5
0.6
0.7
0.8
0.9
1.0
VSD, SOURCE-TO-DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation vs. Gate Resistance
100
Figure 10. Diode Forward Voltage vs. Current
ID, DRAIN CURRENT (A)
10 dc 1
10 ms
1 ms
100 ms 10 ms
0.1
VGS = 10 V Single Pulse TC = 25C RDS(on) Limit Thermal Limit Package Limit 1 10 100 1000
0.01
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased Safe Operating Area for NDF04N60Z
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4
NDF04N60Z, NDP04N60Z, NDD04N60Z
TYPICAL CHARACTERISTICS
10
1.0 R(t) (C/W)
50% (DUTY CYCLE) 20% 10% 5.0% 2.0% 1.0% SINGLE PULSE
0.1
0.01
0.001 0.000001 0.00001 0.0001 0.001 0.01 PULSE TIME (s) 0.1 1.0 10 100 1000
Figure 12. Thermal Impedance for NDF04N60Z
ORDERING INFORMATION
Order Number NDF04N60ZG NDP04N60ZG NDD04N60Z-1G NDD04N60ZG Package TO-220FP (Pb-Free) TO-220AB (Pb-Free) IPAK (Pb-Free) DPAK (Pb-Free) Shipping 50 Units / Rail In Development In Development In Development
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. LEADS
HEATSINK 0.110 MIN
Figure 13. Mounting Position for Isolation Test
Measurement made between leads and heatsink with all leads shorted together.
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NDF04N60Z, NDP04N60Z, NDD04N60Z
PACKAGE DIMENSIONS
TO-220 FULLPAK CASE 221D-03 ISSUE J
-T- F Q A
123 SEATING PLANE
-B-
C S U
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 3. 221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03. INCHES MIN MAX 0.617 0.635 0.392 0.419 0.177 0.193 0.024 0.039 0.116 0.129 0.100 BSC 0.118 0.135 0.018 0.025 0.503 0.541 0.048 0.058 0.200 BSC 0.122 0.138 0.099 0.117 0.092 0.113 0.239 0.271 MILLIMETERS MIN MAX 15.67 16.12 9.96 10.63 4.50 4.90 0.60 1.00 2.95 3.28 2.54 BSC 3.00 3.43 0.45 0.63 12.78 13.73 1.23 1.47 5.08 BSC 3.10 3.50 2.51 2.96 2.34 2.87 6.06 6.88
H K
-Y-
G N L D
3 PL M
J R
DIM A B C D F G H J K L N Q R S U
0.25 (0.010)
B
M
Y
STYLE 1: PIN 1. GATE 2. DRAIN 3. SOURCE
TO-220AB CASE 221A-09 ISSUE AE
-T- B
4 SEATING PLANE
F
T
C S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.161 0.095 0.105 0.110 0.155 0.014 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ----0.080 GATE DRAIN SOURCE DRAIN MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 4.09 2.42 2.66 2.80 3.93 0.36 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ----2.04
Q
123
A U K
H Z L V G D N
R J
STYLE 5: PIN 1. 2. 3. 4.
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NDF04N60Z, NDP04N60Z, NDD04N60Z
PACKAGE DIMENSIONS
IPAK CASE 369D-01 ISSUE B
B V R
4
C E Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K R S V Z INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.180 0.215 0.025 0.040 0.035 0.050 0.155 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.45 0.63 1.01 0.89 1.27 3.93 ---
S -T-
SEATING PLANE
A
1 2 3
K
F D G
3 PL
J
H
M
0.13 (0.005)
T
STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
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NDF04N60Z, NDP04N60Z, NDD04N60Z
PACKAGE DIMENSIONS
DPAK CASE 369AA-01 ISSUE A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.025 0.035 0.018 0.024 0.030 0.045 0.386 0.410 0.018 0.023 0.090 BSC 0.180 0.215 0.024 0.040 0.020 --- 0.035 0.050 0.155 --- MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.63 0.89 0.46 0.61 0.77 1.14 9.80 10.40 0.46 0.58 2.29 BSC 4.57 5.45 0.60 1.01 0.51 --- 0.89 1.27 3.93 ---
-T- B V R
4
SEATING PLANE
C E
S
A
1 2 3
Z H U
F L D
2 PL
J
DIM A B C D E F H J L R S U V Z
0.13 (0.005)
M
T
STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
SOLDERING FOOTPRINT*
6.20 0.244 3.0 0.118
2.58 0.101
5.80 0.228
1.6 0.063
6.172 0.243
SCALE 3:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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NDF04N60Z/D

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